Kit for optical semiconductor encapsulation
AssigneeNitto Denko Corporation
InventorsHirokazu MATSUDA, Koji AKAZAWA, Kazuya FUJIOKA
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Abstract
The present invention relates to a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; a kit for optical semiconductor encapsulation including a sheet-shaped first encapsulating material containing inorganic particles and a liquid second encapsulating material containing a phosphor; and a kit for optical semiconductor encapsulation including a liquid first encapsulating material containing inorganic particles and a sheet-shaped second encapsulating material containing a phosphor.
Claims15
A kit for optical semiconductor encapsulation comprising:
- a liquid first encapsulating material containing inorganic particles;
- and
- a liquid second encapsulating material containing a phosphor.
A kit for optical semiconductor encapsulation comprising:
- a sheet-shaped first encapsulating material containing inorganic particles;
- and
- a liquid second encapsulating material containing a phosphor.
A kit for optical semiconductor encapsulation comprising:
- a liquid first encapsulating material containing inorganic particles;
- and
- a sheet-shaped second encapsulating material containing a phosphor.
Dependencies are inferred from the claim text.