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US 2011/0079927 A1Published application
Photosensitive adhesive composition, and obtained using the same, adhesive film, adhesive sheet, semiconductor wafer with adhesive layer, semiconductor device and electronic part
AssigneeHitachi Chemical Company, Ltd.
InventorsTakashi Kawamori, Takashi Masuko, Shigeki Katogi, Masaaki Yasuda
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Abstract
A photosensitive adhesive composition comprising: (A) a polyimide having a carboxyl group as a side chain, whereof the acid value is 80 to 180 mg/KOH; (B) a photo-polymerizable compound; and (C) a photopolymerization initiator.
Claims13
A photosensitive adhesive comprising:
- (A) a polymer having the ability after being exposed to form a pattern with a developer solution;
- (B) a photo-polymerizable compound;
- and
- (C) a photopolymerization initiator.
1 more element
Dependencies are inferred from the claim text.