Method of manufacturing substrate for flip chip and substrate for flip chip manufactured using the same

A substrate for flip chip, the substrate comprising:

• a base substrate including at least one conductive pad;
• a solder resist layer formed on the base substrate and having an opening exposing the conductive pad;
• a metal post filling at least a part of the opening;
• and
• a solder cap formed on the metal post and having a planarized surface.

A method of manufacturing a package substrate, the method comprising:

• providing a base substrate including at least one conductive pad;
• forming a solder resist layer on the base substrate, the solder resist layer including a first opening exposing the conductive pad;
• forming a dry film on the solder resist layer, the dry film including a second opening connected with the first opening;
• forming a metal post in the first opening and a part of the second opening;
• filling the second opening above the metal post with solder paste;
• forming a solder cap by performing a reflow process on the filled solder paste;
• planarizing a surface of the solder cap;
• removing the dry film;
• providing a chip substrate including at least one metal pad;
• and
• bonding the base substrate with the chip substrate such that the solder cap having the planarized surface corresponds to the metal pad.

A package substrate comprising:

• a base substrate including at least one conductive pad;
• a solder resist layer formed on the base substrate and having an opening exposing the conductive pad;
• a metal post filling at least a part of the opening;
• a solder cap formed on the metal post and having a planarized surface;
• and
• a chip substrate including at least one metal pad and bonded with the base substrate such that the metal pad corresponds to the solder cap having the planarized surface.