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US 2011/0079920 A1Published application
Electrical connection via for the substrate of a semiconductor device
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorsHamed Chaabouni, Lionel Cadix
Life of this patent
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Abstract
An electrical connection via is formed through a substrate to make an electrical connection from one face of the substrate to the other. The via includes a ring made of an electrically conductive material. The ring is formed in a hole in the substrate so as to at least partly form the via.
Claims27
A process, comprising:
- producing a hole in a substrate;
- producing in the hole of at least one ring made of an electrically conductive material at least partly forming an electrical connection via through the substrate in order to make an electrical connection from one face of the substrate to another face of the substrate.
Apparatus, comprising:
- a substrate of a semiconductor device;
- at least one via providing an electrical connection from one face to another face of the substrate;
- wherein the via is made of an electrically conductive material;
- wherein the via comprises at least one conducting ring made in a hole passing through the substrate.
1 more element
Apparatus, comprising:
- a substrate of a semiconductor device;
- at least one via providing an electrical connection from one face of the substrate to another face of the substrate,
- wherein the via is made of an electrically conductive material,
- wherein each portion of the via has a thickness at most twice a skin depth in the material forming the via.
1 more element
A process, comprising:
- forming a cylindrical aperture in a substrate;
- forming within the cylindrical aperture a first annular layer of insulating material;
- forming on an inner peripheral wall of the first annular layer of insulating material a first annular layer of conductive material.
Dependencies are inferred from the claim text.