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US 2011/0079919 A1Published application
Electrical connection via for the substrate of a semiconductor device
AssigneeSTMicroelectronics (Crolles 2) SAS
InventorsHamed Chaabouni, Lionel Cadix
Life of this patent
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Abstract
An electrical connection via passing through a substrate for a semiconductor device is made of at least one conducting ring formed in an annular hole passing through the substrate.
Claims25
A process, comprising:
- producing an annular hole in a substrate;
- filling the annular hole with an electrically conductive material in order to obtain a conducting ring at least partly forming an electrical connection via through the substrate in order to make an electrical connection from one face of the substrate to another face of the substrate.
Apparatus, comprising:
- a substrate for a semiconductor device;
- at least one via providing an electrical connection from one face of the substrate to another face of the substrate;
- wherein the electrical connection via is made of an electrically conductive material;
- wherein the electrical connection via comprises at least one conducting ring made in an annular hole passing through the substrate.
1 more element
Apparatus, comprising:
- a substrate for a semiconductor device;
- at least one via providing an electrical connection from one face to another face of the substrate;
- wherein the via is made of an electrically conductive material;
- wherein each portion of the via has a thickness at most twice a skin depth (δ) in a material forming the via.
1 more element
A process, comprising:
- producing an annular hole in a substrate;
- filling the annular hole with an electrically conductive material in order to obtain a ring of the electrically conductive material.
Dependencies are inferred from the claim text.