Electronic assemblies including mechanically secured protruding bonding conductor joints

An electronic assembly, comprising:

• an IC die comprising a substrate including a semiconductor top surface having active circuitry thereon and a bottom surface, and at least one protruding bonding feature having sidewall surfaces and a leading edge surface extending from said semiconductor top surface or said bottom surface;
• and
• a workpiece having a workpiece surface comprising at least one electrical connector and at least one framed hollow receptacle coupled to said electrical connector comprising a metal including sidewall portions and a bent top portion that defines a cavity, wherein said bent top portion comprises bent peripheral shelf regions that point downward into said cavity and towards said sidewall portions;
• wherein said protruding bonding feature is inserted within said cavity and wherein said protruding bonding feature contacts said bent peripheral shelf regions along a contact area to form a metallic joint, said contact area being at least primarily along said sidewall surfaces.

An electronic assembly, comprising

• an IC die;
• a workpiece;
• and
• an electrical connector connecting the IC die and the workpiece including a protruding bonding feature extended from the IC die inserted within a framed hollow receptacle on the workpiece.