Back to results
US 2011/0079911 A1Published application
Method for the Connection of Two Wafers, and a Wafer Arrangement
AssigneeOSRAM Opto Semiconductors GmbH
InventorKlaus STREUBEL
Life of this patent
Estimating the term…
Abstract
A method for the connection of two wafers in which a contact area is formed between the two wafers by placing the two wafers one on top of the other. The contact area is heated locally and for a limited time. A wafer arrangement comprises two wafers which have been placed one on top of the other and between whose opposite surfaces a contact area is located. The wafers are connected to one another at selected areas of the contact area.
Claims22
A wafer arrangement, comprising:
- two wafers placed one on top of the other;
- and
- a contact area between the two wafers;
- wherein
- the two wafers are connected to one another at selected connection areas of the contact area,
- at least one of the two wafers is a silicon wafer, a germanium wafer, a gallium arsenide wafer, an InP wafer, a ceramic wafer or a GaP wafer,
- a mechanical joint between the two wafers is mediated or effected by a material between the two wafers, wherein said material is applied at least in said selected connection areas,
- at least one of the two wafers comprises two or more individual layers, and
- at least one of the two or more individual layers is an epitaxially applied layer comprising an active layer configured to produce or to detect radiation, and wherein at least one of the two or more individual layers is part of an optoelectronic component.
6 more elements
A wafer arrangement, comprising:
- two wafers placed one on top of the other;
- and
- a contact area between the two wafers, wherein the two wafers are connected to one another at selected connection areas of the contact area.
Dependencies are inferred from the claim text.