Semiconductor device having a copper plug
AssigneeInternational Business Machines Corporation
InventorsMUKTA G. FAROOQ, Emily R. Kinser, Ian D. Melville, Krystyna W. Semkow
Life of this patent
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Abstract
Disclosed is a semiconductor device wherein an insulation layer has a copper plug in contact with the last wiring layer of the device. There may also be a barrier layer separating the copper plug from the insulation layer. In a further embodiment, there may also be an aluminum layer between the insulation layer and copper plug. Also disclosed is a process for making the semiconductor device.
Claims25
A semiconductor device comprising:
- a semiconductor substrate having a plurality of wiring layers wherein the last wiring level comprises a conductive material;
- an insulation layer formed on the last wiring layer, the insulation layer having a via opening formed therein to expose the conductive material in the last wiring layer;
- a barrier layer formed in the via opening;
- and
- a copper plug formed on the barrier layer and filling the via opening.
A semiconductor device comprising:
- a semiconductor substrate having a last wiring layer that comprises a conductive material;
- an insulation layer formed on the last wiring layer, the insulation layer having a via opening formed therein to expose the conductive material in the last wiring layer;
- and
- a copper plug formed in, and filling, the via opening.
A method of forming a semiconductor device comprising:
- obtaining a semiconductor substrate having a plurality of wiring layers wherein the last wiring layer comprises a conductive material;
- forming an insulation layer on the last wiring layer,
- forming a via opening in the insulation layer to expose the conductive material in the last wiring layer;
- forming a barrier layer in the via opening;
- and
- forming a copper plug on the barrier layer and filling the via opening.
A method of forming a semiconductor device comprising:
- forming an insulation layer on a last wiring layer of a semiconductor device;
- forming a via opening in the insulation layer to expose a conductive material in the last wiring layer;
- and
- forming a copper plug in, and filling, the via opening.
Dependencies are inferred from the claim text.