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US 2011/0079906 A1Published application
Pre-packaged structure
OwnerShih-Wei Tsai, Hsiang-Chung Changinventors
Life of this patent
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Abstract
A pre-packaged structure includes a substrate with a substrate circuit, a die having a core circuit and disposed on the substrate, a passivation selectively covering the core circuit, a buffer metal layer electrically connected to the core circuit and completely covering the passivation and a copper wire bond electrically connected to the buffer metal layer and the substrate circuit.
Claims19
A pre-packaged structure, comprising:
- a substrate comprising a substrate circuit;
- a die having a core circuit and disposed on said substrate;
- a passivation selectively covering said core circuit;
- a buffer metal layer electrically connected to said core circuit and covering said passivation, wherein said buffer metal layer has a thickness of at last 5 μm;
- and
- a copper wire bond electrically connected to said buffer metal layer and to said substrate circuit.
3 more elements
A pre-packaged structure, comprising:
- a substrate comprising a substrate circuit;
- a die having a core circuit and disposed on said substrate;
- a passivation selectively covering said core circuit;
- a buffer metal layer electrically connected to said core circuit and completely covering said passivation;
- and
- a copper wire bond electrically connected to said buffer metal layer and to said substrate circuit, wherein one end of said copper wire bond which is electrically connected to said buffer metal layer is disposed right above said core circuit.
3 more elements
Dependencies are inferred from the claim text.