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US 2011/0079905 A1Published application
Die Stacking System and Method
AssigneeQUALCOMM Incorporated
InventorsHenry Sanchez, Laxminarayan Sharma
Life of this patent
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Abstract
Die stacking systems and methods are disclosed. In an embodiment, a semiconductor device includes a passivation surface and a conductive die receiving surface located in an opening of the passivation surface. The conductive die receiving surface has a surface area that is larger than a footprint of a second die that is electrically coupled to the conductive die receiving surface.
Claims30
A semiconductor device comprising:
- a first die including a passivation surface and a conductive die receiving surface located in an opening of the passivation surface,
- wherein the conductive die receiving surface has a first surface area, and
- wherein the first surface area is larger than a footprint of a second die electrically coupled to the conductive die receiving surface.
A system comprising:
- a first die including a passivation surface, a bond pad, and a conductive die receiving surface distinct from the bond pad and located in an opening of the passivation surface,
- wherein the conductive die receiving surface has a surface area, and
- wherein the conductive die receiving surface is sized to seat and electrically couple to a second die having a footprint smaller than the surface area.
A package comprising:
- a first die including a passivation surface and a conductive die receiving surface located in an opening of the passivation surface, wherein the conductive die receiving surface has a first surface area;
- a second die seated on and electrically coupled to the conductive die receiving surface of the first die, wherein the second die has a footprint corresponding to a second surface area;
- and
- a third die seated on and electrically coupled to the conductive die receiving surface of the first die, wherein the third die has a footprint corresponding to a third surface area,
- wherein the first surface area is larger than a sum of the second surface area and the third surface area.
2 more elements
A device comprising:
- first die means having a surface that includes a passivation area, at least one conductive bond pad area, and a large conductive area sized to receive at least a second die,
- wherein the conductive die receiving surface has a surface area, and
- wherein the surface area is larger than a footprint of second die means electrically coupled to the conductive die receiving surface.
A method comprising
- providing a first die that has a passivation surface with an opening;
- depositing conductive material in the opening of the passivation surface to form a layer having a conductive die receiving surface;
- and
- electrically coupling a second die to the conductive die receiving surface,
- wherein the conductive die receiving surface has a surface area that is greater than a footprint of the second die.
2 more elements
Dependencies are inferred from the claim text.