Semiconductor device
OwnerTakeshi SAKAMOTO, Katsumi Otani +1inventors
InventorsTakeshi SAKAMOTO, Katsumi Otani, Kimihito Kuwabara
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Abstract
A semiconductor device has a wiring substrate provided with an external connecting terminal on a lower surface, a semiconductor chip mounted onto an upper surface of the wiring substrate, a cap-shaped heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip, a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate, and a heat transfer material sandwiched between a lower surface of the heat dissipation member just above the semiconductor chip and the upper surface of the semiconductor chip.
Claims12
A semiconductor device, comprising:
- a wiring substrate;
- a semiconductor chip mounted onto an upper surface of the wiring substrate;
- a heat dissipation member arranged on the upper surface of the wiring substrate so as to cover the semiconductor chip;
- a fixing pin for fixing the heat dissipation member onto the upper surface of the wiring substrate;
- a first heat transfer material sandwiched between a lower surface of the heat dissipation member and an upper surface of the semiconductor chip;
- and
- a second heat transfer material sandwiched between the wiring substrate and the heat dissipation member,
- wherein
- the fixing pin pierces the heat dissipation member and the second heat transfer material.
Dependencies are inferred from the claim text.