Methods of Forming Back Side Layers For Thinned Wafers and Related Structures
AssigneeAmkor Technology, Inc.
InventorsGlenn A. Rinne, Kevin Engel, Julia Roe, Chirstopher John Berry
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Abstract
A method of processing a wafer including a plurality of integrated circuit devices on a front side of the wafer, may include thinning the wafer from a back side opposite the front side. After thinning the wafer, a back side layer may be provided on the back side of the thinned wafer opposite the front side, and the back side layer may be configured to counter stress on the front side of the wafer including the plurality of integrated circuit devices thereon. After providing the back side layer, the plurality of integrated circuit devices may be separated. Related structures are also discussed.
Claims20
An electronic structure comprising:
- a wafer including opposing front and back sides;
- a plurality of integrated circuit devices on the front side of the wafer;
- a back side layer on the back side of the wafer opposite the front side wherein the back side layer is patterned so that portions of the back side of the wafer are exposed through the back side layer.
Dependencies are inferred from the claim text.