Embedded integrated circuit package system and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsYou Yang Ong, Dioscoro A. Merilo, Seng Guan Chow
Life of this patent
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Abstract
A method of manufacture of an embedded integrated circuit package system includes: forming a first conductive pattern on a first structure; connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps; forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern; forming a channel in the substrate forming encapsulation; and applying a conductive material in the channel.
Claims17
A method of manufacture of an embedded integrated circuit package system comprising:
- forming a first conductive pattern on a first structure;
- connecting a first integrated circuit die, having bumps on a first active side, directly on the first conductive pattern by the bumps;
- forming a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern;
- forming a channel in the substrate forming encapsulation;
- and
- applying a conductive material in the channel.
A method of manufacture of an embedded integrated circuit package system comprising:
- forming a first conductive pattern, with a contact, on a first structure;
- connecting a first integrated circuit die, having bumps on a first active side, directly on the contact by the bumps;
- molding a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern;
- forming a channel in the substrate forming encapsulation;
- and
- plating a conductive material in the channel.
An embedded integrated circuit package system comprising:
- a first conductive pattern on a first structure;
- a first integrated circuit die, having bumps on a first active side, coupled directly on the first conductive pattern by the bumps;
- a substrate forming encapsulation to cover the first integrated circuit die and the first conductive pattern;
- a channel in the substrate forming encapsulation;
- and
- a conductive material in the channel.
Dependencies are inferred from the claim text.