Semiconductor device and method of manufacturing the same, circuit board, and electronic instrument

A semiconductor device comprising:

• an insulating film in which a penetrating hole is formed, the penetrating hole extending between a first surface of the insulating film and a second surface of the insulating film opposite to the first surface of the insulating film;
• a wiring pattern that is adhered to the first surface of the insulating film by an adhesive material, a first portion of the wiring pattern formed over the penetrating hole, a part of the adhesive material formed on an internal wall surface forming the penetrating hole so as not to stop up the penetrating hole;
• an external electrode that contacts the first portion of the wiring pattern and projecting through the penetrating hole and extending beyond the second surface of the insulating film;
• and
• a semiconductor chip that has an electrode electrically connected to the wiring pattern, the semiconductor chip being mounted to the first surface of the insulating film.