Integrated circuit chip and flip chip package having the integrated circuit chip

A flip chip package comprising:

• a mounting substrate including a body in which a mounting circuit pattern is arranged, an upper contact pad on an upper surface of the body and a lower contact pad on a lower surface of the body, the mounting circuit pattern being electrically connected to both of the upper and lower contact pad;
• an integrated circuit (IC) chip to make contact with the upper contact pad of the mounting substrate, the IC chip including a first bump structure arranged in a pad area in which no wiring line is arranged and a second bump structure arranged in a pseudo pad area in which a wiring line is arranged;
• an exterior terminal connected to the lower contact pad;
• and
• a under-filling layer to fill a gap space between the mounting substrate and the IC chip.

An integrated circuit (IC) chip, comprising:

• an IC device including at least a substrate, an insulation, layer, and a wiring line, the IC device having a first area and a second area;
• a first electrode pad disposed on the insulation layer of the IC device in the first area that does not make contact with the wiring line;
• a first bump structure disposed on the first area to make contact with the first electrode pad;
• a second electrode pad disposed on the insulation layer of the IC device in the second area that makes contact with the wiring line;
• and
• a second bump structure disposed on the second area to make contact with the second electrode pad at a contact point that is spaced apart from the wiring line.

An integrated circuit (IC) chip, comprising:

• an IC device including at least a substrate, an insulation, layer, and a wiring line, the IC device having a first area and a second area;
• a first electrode pad disposed on the insulation layer of the IC device in the first area that does not make contact with the wiring line;
• a first bump structure disposed on the first area to make contact with the first electrode pad;
• a second electrode pad disposed on the insulation layer of the IC device in the second area that makes contact with the wiring line;
• and
• a second bump structure to make contact with the second electrode pad at a first contact point that is spaced apart from the wiring line at a first distance in a first direction, and to make contact with the second electrode pad at a second contact point that is spaced apart from the wiring line at a second distance in a second direction.