Integrated circuit package system for stackable devices and method for manufacturing thereof

A method for manufacturing an integrated circuit package system comprising:

• forming an internal stacking module including:
• providing a stack die, and
• encapsulating the stack die with an insulating material having a protruding support and a pad connected to the stack die;
• providing a package base having a component surface;
• mounting the internal stacking module on the component surface;
• connecting a stack interconnect between the pad and the component surface;
• mounting a top die on the protruding support;
• connecting a top die interconnect between the top die and the component surface;
• and
• applying a package encapsulant over the top die, over the component surface, and adjacent the internal stacking module, the stack interconnect and the top die interconnect.

An integrated circuit package system comprising:

• a stack module including:
• a stack die, and
• the stack die encapsulated with an insulating material having a protruding support and a pad connected to the stack die;
• the stack module mounted on a package base;
• the pad connected to the package base;
• a top die connected to the package base;
• and
• the top die, the package base, and the stack module encapsulated with a package encapsulant.