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US 2011/0079887 A1Published application
Lead frame and method of manufacturing the same
AssigneeSamsung Techwin Co., Ltd.
InventorsChang-han SHIM, Sung-kwan PAEK
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Abstract
A lead frame having improved connectivity with a molded portion and a method of manufacturing the lead frame are provided. The lead frame includes a die pad on which a semiconductor chip is to be disposed; at least one lead portion arranged to be connected to the semiconductor chip; and at least one plating layer formed on at least one of the at least one lead portion and the die pad, wherein a top surface of the at least one plating layer has an uneven portion having a first average surface roughness.
Claims29
A lead frame comprising:
- at least one lead portion arranged to be connected to at least one semiconductor chip;
- and
- at least one plating layer formed on at least one of the at least one lead portion,
- wherein a top surface of the at least one plating layer comprises an uneven portion having a first average surface roughness, and the plating layer comprises a copper (Cu) plating layer containing copper and a protective plating layer formed on the Cu plating layer.
1 more element
A method of manufacturing a lead frame, the method comprising:
- forming at least one lead portion by patterning a raw material substrate;
- and
- forming at least one plating layer on at least one of the at least one lead portion so that a top surface of the at least one plating layer comprises an uneven portion having a first average surface roughness,
- wherein the forming the at least one plating layer comprises:
- forming a copper (Cu) plating layer containing copper on the at least one of the at least one lead portion;
- and
- forming a protective plating layer on the Cu plating layer, wherein the top surface of the at least one plating layer is a top surface of the protective plating layer.
4 more elements
Dependencies are inferred from the claim text.