Integrated circuit packaging system with pad connection and method of manufacture thereof
AssigneeSTATS ChipPAC, Ltd.
InventorsHenry Descalzo Bathan, Flynn Carson, Zigmund Ramirez Camacho, Emmanuel Espiritu
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Abstract
A method of manufacture of an integrated circuit packaging system includes: providing a package paddle; forming a pad extension having a spacing to the package paddle; forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead; forming a conductive layer directly on and between the package paddle and the pad extension; and connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle.
Claims20
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle;
- forming a pad extension having a spacing to the package paddle;
- forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead;
- forming a conductive layer directly on and between the package paddle and the pad extension;
- and
- connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle.
A method of manufacture of an integrated circuit packaging system comprising:
- providing a package paddle;
- forming a pad extension having a spacing to the package paddle;
- forming a lead adjacent the pad extension, the pad extension between the package paddle and the lead;
- forming a conductive layer directly on and between the package paddle and the pad extension;
- connecting an integrated circuit to the pad extension and the lead, the integrated circuit over the package paddle;
- and
- forming an encapsulation over the conductive layer covering the integrated circuit.
An integrated circuit packaging system comprising:
- a package paddle;
- a pad extension having a spacing to the package paddle;
- a lead adjacent the pad extension, the pad extension between the package paddle and the lead;
- a conductive layer directly on and between the package paddle and the pad extension;
- and
- an integrated circuit connected to the pad extension and the lead, the integrated circuit over the package paddle.
Dependencies are inferred from the claim text.