Integrated circuit packaging system with shaped lead and method of manufacture thereof

A method of manufacture of an integrated circuit packaging system comprising:

• forming a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface;
• forming a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface;
• attaching an integrated circuit die to the die attach paddle;
• connecting a conductive connector to the integrated circuit die and the package lead;
• and
• applying an encapsulation over the integrated circuit die, the encapsulation conformed to the retention structure and exposing a portion of the package lead and of the die attach paddle.

An integrated circuit packaging system comprising:

• a package lead having a retention structure around a perimeter of the package lead with a first concave surface, a ridge, and a second concave surface;
• a die attach paddle adjacent the package lead and having an another retention structure around a perimeter of the die attach paddle with an another first concave surface, an another ridge, and an another second concave surface;
• an integrated circuit die attached to the die attach paddle;
• a conductive connector connected to the integrated circuit die and the package lead;
• and
• an encapsulation over the integrated circuit die and conformal to the retention structure, a portion of the package lead exposed from the encapsulation.