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US 2011/0079882 A1Published application
Wafer and a Method for Manufacturing a Wafer
AssigneeInfineon Technologies AG
InventorsHans-Joachim Schulze, Hans-Joerg Timme, Helmut Strack
Life of this patent
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Abstract
A wafer includes a wafer frontside and a region adjacent to the device surface, wherein the region includes vacancy-oxygen complexes and the wafer frontside includes a predetermined surface structure to form thereon a device with a desired property.
Claims20
A wafer, comprising:
- a wafer frontside with a predetermined surface structure, to form thereon or below a device with a desired property;
- and
- a region with vacancy-oxygen complexes, the region adjacent to the wafer frontside.
An apparatus, comprising:
- a substrate comprising a surface and a region with vacancy-oxygen complexes adjacent to the surface;
- and
- a device formed on the surface or in the substrate.
An apparatus, comprising:
- means for supporting a device with a surface;
- and
- means for electrically insulating the device,
- wherein the means for electrically insulating is formed in the means for supporting adjacent to the surface and comprises vacancy-oxygen complexes.
1 more element
Dependencies are inferred from the claim text.