Passive device, semiconductor module, electronic circuit board, and electronic system having the passive device, and methods of fabricating and inspecting the semiconductor module
AssigneeSamsung Electronics Co., Ltd.
InventorsSeong-Chan HAN, Jin-Kyu Yang, Jae-Young Kim, Kwang-Su Yu
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Abstract
Provided are a passive device of a semiconductor module, a semiconductor module having the passive device, an electronic circuit board and electronic system having the passive device or semiconductor module, and methods of fabricating and inspecting the semiconductor module. The passive device of the semiconductor module includes a main body and at least two real electrodes disposed on one lateral surface of the main body.
Claims12
A passive device of a semiconductor module, comprising:
- a main body;
- and
- at least two real electrodes disposed on a first lateral surface of the main body.
A passive device of a semiconductor module, comprising:
- a main body;
- at least two real electrodes disposed on a first lateral surface of the main body, each real electrode having a fillet shape;
- and
- at least one dummy electrode disposed on a second lateral surface of the main body disposed opposite the first lateral surface thereof, and having a fillet shape,
- wherein the real electrodes are electrically connected to one another, and the dummy electrode is not electrically connected to the real electrodes.
-21. (canceled)
A passive device of a semiconductor module, comprising:
- a main body;
- and
- a plurality of real electrodes disposed in channels of a first surface of the main body and electrically connected to one another.
(canceled)
Dependencies are inferred from the claim text.