Optical-semiconductor encapsulating material
AssigneeNitto Denko Corporation
InventorsKazuya FUJIOKA, Hirokazu MATSUDA, Koji AKAZAWA
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Abstract
The present invention relates to a sheet-shaped optical-semiconductor encapsulating material including: a first resin layer containing inorganic particles; and a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer, and relates to a kit for optical-semiconductor encapsulation including: a sheet-shaped molded body including a first resin layer containing inorganic particles; and a sheet-shaped molded body including a second resin layer containing a phosphor.
Claims11
A sheet-shaped optical-semiconductor encapsulating material comprising:
- a first resin layer containing inorganic particles;
- and
- a second resin layer containing a phosphor and being superposed directly or indirectly on the first resin layer.
A kit for optical-semiconductor encapsulation comprising:
- a sheet-shaped molded body comprising a first resin layer containing inorganic particles;
- and
- a sheet-shaped molded body comprising a second resin layer containing a phosphor.
An optical semiconductor device comprising:
- a substrate having an optical semiconductor element mounted thereon;
- a first resin layer containing inorganic particles;
- and
- a second resin layer containing a phosphor,
- wherein the optical semiconductor element is encapsulated with the first resin layer and the second resin layer in this order.
Dependencies are inferred from the claim text.