Light emitted diode substrate and method for producing the same

A method for producing a light emitted diode (LED) substrate comprising steps of:

• providing a conductive metallic board with a top, a bottom and four sides and the conductive metallic board is made of aluminum (Al) or copper (Cu);
• forming multiple grooves in the top of the conductive metallic board;
• protecting the conductive metallic board from corrosion;
• forming multiple copper layers having forming multiple copper layers on the conductive metallic board to be served as circuits and wires for plating and exposing the top of the conductive metallic board with the conversion coating and without contacting the adhesive layers to form an etched substrate;
• electroless plating the etched substrate including pretreating the etched substrate and immersing the etched substrate into an electroless nickel (Ni) plating bath and electroless plating all exposing metal of the etched substrate to form an electroless plated substrate with electroless Ni layers;
• attaching a thermal resistant adhesive tape on a bottom of the electroless plated substrate;
• plating metal on the electroless plated substrate at least having a step of plating spraying tin or plating gold or plating silver on a top of the electroless plated substrate;
• and
• coating solder mask partially on the metal to obtain the LED substrate.