Heat conducting apparatus and solder melting method therefor

A heat conducting apparatus for hot-melting tin solders between a circuit board and a soldered component, said heat conducting apparatus comprising:

• an air guide hood to be connected to a hot air supply source for delivering hot air, said air guide hood including at least one air outlet for exit of the hot air, and
• a flexible device disposed at said air outlet of said air guide hood, said flexible device including a flexible tube that is bendable to be disposed at a desired adjusted angular position, said flexible tube having one end connected to said air guide hood and aligned with said air outlet so as to guide the hot air flowing out of said air outlet to the tin solders between the soldered component and the circuit board to melt the tin solders.

A solder melting method for a heat conducting apparatus for hot-melting tin solders between a circuit board and a soldered component, the solder melting method comprising:

• (A) heating a heat conducting device in contact with the soldered component to enable the heat conducting device to conduct the heat to the soldered component so as to melt the tin solders between the soldered component and the circuit board;
• and
• (B) removing the soldered component so as to separate the soldered component from the circuit board.