US 2011/0079632 A1Published application

Multistack solder wafer filling

AssigneeInternational Business Machines Corporation

InventorsS. Jay Chey, David Danovitch, Peter A. Gruber, Cornelia K. Tsang

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Abstract

A plurality of through-substrate holes is formed in each of at least one substrate. Each through-substrate hole extends from a top surface of the at least one substrate to the bottom surface of the at least one substrate. The at least one substrate is held by a stationary chuck or a rotating chuck. Vacuum suction is provided to a set of through-substrate holes among the plurality of through-substrate holes through a vacuum manifold attached to the bottom surface of the at least one substrate. An injection mold solder head located above the top surface of the at least one substrate injects a solder material into the set of through-substrate holes to form a plurality of through-substrate solders that extend from the top surface to the bottom surface of the at least one substrate. The vacuum suction prevents formation of air bubbles or incomplete filling in the plurality of through-substrate holes.

Claims25

Dependent claims

An apparatus for forming at least one seamless conductive solder structure through at least one substrate, said apparatus including an upper assembly, a lower assembly, and a vacuum pump, wherein said upper assembly and said lower assembly are configured to move relative to each other, said upper assembly is located above said lower assembly and is configured to provide a solder material through an opening on a bottom surface of said upper assembly,

and said lower assembly includes:
a chuck including a vacuum pumping line, wherein said chuck is configured to laterally confine said at least one substrate, and said vacuum pumping line is connected to said vacuum pump;
and
a filter structure located within a recessed region of said chuck, wherein said filter structure is configured to vertically support a bottom surface of said at least one substrate and connected to said vacuum pumping line, to contact said bottom surface of said at least one substrate and a sidewall of said chuck, and to be encapsulated within a confined volume contiguously bounded by said at least one substrate, said chuck, said vacuum pumping line, and said vacuum pump, whereby said upper assembly injects said solder material through at least one through-substrate hole extending from a top surface of said at least one substrate to said bottom surface of said at least one substrate to faun at least one through-substrate seamless conductive solder structure that extends from said top surface of said at least one substrate to said bottom surface of said at least one substrate.

1 more element

An apparatus for forming at least one seamless conductive solder structure through at least one substrate, said apparatus including a set of an upper assembly and a lower assembly, a middle assembly, and a vacuum pump, wherein said middle assembly and said set of said upper and lower assemblies are configured to move relative to each other while said upper assembly maintains a same relative position with respect to said lower assembly,

wherein said upper assembly is located above said middle assembly, and said upper assembly is configured to provide a solder material through an opening on a bottom surface of said upper assembly,
wherein said middle assembly includes a first chuck configured to laterally confine said at least one substrate and maintain a same relative position with respect to said at least one substrate,
wherein said lower assembly includes a second chuck including a vacuum manifold that is connected to said vacuum pump,
whereby said upper assembly injects said solder material through at least one through-substrate hole extending from a top surface of said at least one substrate to a bottom surface of said at least one substrate to form at least one through-substrate seamless conductive solder structure that extends from said top surface of said at least one substrate to said bottom surface of said at least one substrate.

1 more element

A method of forming at least one seamless conductive solder structure through at least one substrate, said method including:

providing an apparatus including an upper assembly, a lower assembly, and a vacuum pump, wherein said upper assembly and said lower assembly are configured to move relative to each other, said lower assembly includes a chuck and a filter structure, and said chuck includes a vacuum pumping line that is connected to said vacuum pump, and said filter structure is located within a recessed region of said chuck;
placing on said filter structure at least one substrate including at least one through-substrate hole extending from a top surface of said at least one substrate to said bottom surface of said at least one substrate, wherein said chuck laterally confines said at least one substrate and said filter structure vertically supports said bottom surface of said at least one substrate;
and
injecting a solder material from said upper assembly into said at least one through-substrate hole, wherein said pump provides vacuum environment to an unfilled portion of a though-substrate hole into which said solder material is injected, whereby at least one through-substrate seamless conductive solder structure that extends from said top surface of said at least one substrate to said bottom surface of said at least one substrate is formed.

1 more element

A method of forming at least one seamless conductive solder structure through at least one substrate, said method including:

providing an apparatus including a set of an upper assembly and a lower assembly, a middle assembly, and a vacuum pump, wherein said middle assembly and said set of said upper and lower assemblies are configured to move relative to each other while said upper assembly maintains a same relative position with respect to said lower assembly, said middle assembly includes a first chuck configured to laterally confine said at least one substrate and maintain a same relative position with respect to said at least one substrate, and said lower assembly includes a second chuck including a vacuum pumping line that is connected to said vacuum pump;
placing on said second chuck at least one substrate including at least one through-substrate hole extending from a top surface of said at least one substrate to said bottom surface of said at least one substrate, wherein said first chuck laterally confines said at least one substrate and said second chuck vertically supports said bottom surface of said at least one substrate;
and
injecting a solder material from said upper assembly into said at least one through-substrate hole, wherein said pump provides vacuum environment to an unfilled portion of a though-substrate hole into which said solder material is injected, whereby at least one through-substrate seamless conductive solder structure that extends from said top surface of said at least one substrate to said bottom surface of said at least one substrate is formed.

1 more element

Dependencies are inferred from the claim text.