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US 2011/0079422 A1Published application
Multilayer substrate
AssigneeNEC Corporation
InventorsTaras Kushita, Jun Sakai, Hikaru Kouta
Life of this patent
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Abstract
A multilayer substrate is provided with a conductor plane region in which a plurality of conductor planes are disposed; a clearance region disposed adjacent to the conductor plane region so that the plurality of conductor planes are excluded from the clearance region. A plurality of signal vias are disposed through the clearance region so that the plurality of signal vias are isolated from the plurality of conductor planes. A conductor post is connected to one of the plurality of conductor planes and disposed between two of the signal vias in the clearance region.
Claims16
A multilayer substrate comprising:
- a conductor plane region in which a plurality of conductor planes are disposed;
- a clearance region disposed adjacent to said conductor plane region so that said plurality of conductor planes are excluded from said clearance region;
- a plurality of signal vias disposed through said clearance region so that said plurality of signal vias are isolated from said plurality of conductor planes;
- and
- a conductor post connected to one of said plurality of conductor planes and disposed to extend to an area between two of said signal vias in said clearance region.
2 more elements
Dependencies are inferred from the claim text.