Printed circuit board and method of manufacturing the same
OwnerYoung Gwan KO, Ryoichi Watanabe +2inventors
InventorsYoung Gwan KO, Ryoichi Watanabe, Sang Soo Lee, Se Won Park
Life of this patent
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Abstract
Disclosed herein is a printed circuit board, including: a base substrate; insulation layers which are formed on both sides of the base substrate and in which trenches are formed; and circuit layers including circuit patterns and vias formed in the trenches using a plating process. The printed circuit board is advantageous in that trenches are formed in both sides of a base substrate, so that a fine circuit pattern can be simultaneously formed on both sides thereof, thereby simplifying the manufacturing process thereof.
Claims19
A printed circuit board, comprising:
- a base substrate;
- insulation layers which are formed on both sides of the base substrate and in which trenches are formed;
- and
- circuit layers including circuit patterns and vias formed in the trenches using a plating process.
A printed circuit board, comprising:
- a base substrate;
- a first insulation layer which is formed on one side of the base substrate and in which trenches are formed;
- a second insulation layer which is formed on the other side of the base substrate and in which viaholes are formed;
- a first circuit layer including circuit patterns and vias formed in the trenches formed in the first insulation layer using a plating process;
- and
- a second circuit layer including vias formed in the second insulation layer.
A method of manufacturing a printed circuit board, comprising:
- forming insulation layers on both sides of a base substrate;
- forming trenches in the insulation layers;
- forming plating layers on the insulation layers including the trenches by a plating process;
- and
- forming circuit layers by removing the plating layers excessively formed on the insulating layers.
A method of manufacturing a printed circuit board, comprising:
- forming a first insulation layer on one side of a base substrate, and forming a second insulation layer on the other side of the base substrate;
- forming trenches in the first insulation layer, and forming viaholes in the second insulation layer;
- and
- forming a first circuit layer in the trenches formed in the first insulation layer by a plating process, and forming a second circuit layer including vias on the second insulation layer by a plating process.
Dependencies are inferred from the claim text.