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US 2011/0079419 A1Published application
Wiring board
AssigneeRenesas Electronics Corporation
InventorYoshiaki SATO
Life of this patent
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Abstract
The wiring board includes: a base material; a copper pattern which is formed in one surface of the base material, and made of a first metal; and a first nickel land and a second nickel land which are formed over the copper pattern in contact with the copper pattern, and made of a second metal having a higher ionization tendency than that of the first metal, wherein a groove reaching the base material is formed in the copper pattern around a region overlapping the first nickel land at least when seen in a plan view.
Claims10
A wiring board comprising:
- a base material;
- a metal pattern which is formed over one surface of said base material, and made of a first metal;
- and
- a first land and a second land which are formed over said metal pattern in contact with said metal pattern, made of a second metal having a higher ionization tendency than that of said first metal, and electrically connected to each other through said metal pattern,
- wherein a groove reaching said base material is formed in said metal pattern around a region overlapping with said first land at least when seen in a plan view.
2 more elements
Dependencies are inferred from the claim text.