Apparatus for semiconductor die bonding

An apparatus for semiconductor die bonding, the apparatus comprising:

• a first and a second bonding head configured to respectively pickup a first and a second semiconductor chip located at a pickup point,
• a first transfer device configured to transfer the first bonding head from the pickup point to a bonding point located on a substrate along a transfer path, the first transfer device further configured to return to the pickup point along a first circuit in a first direction from the bonding point to the pickup point;
• a second transfer device configured to transfer the second bonding head from the pickup point to the bonding point located on the substrate along the transfer path, the second transfer device further configured to return to the pickup point along a first circuit in a second direction from the bonding point to the pickup point;
• a controller configured to alternately apply a transfer signal and a return signal to the first transfer device and the second transfer device so that the first bonding head and the second bonding head do not interfere with each other;
• a chip picker configured to pickup a third semiconductor chip from a picking point of a wafer fixed to a wafer table and the chip picker configured to transfer the third semiconductor chip to the pickup point to hand over the third semiconductor chip to the first bonding head or the second bonding head;
• and
• a picker flip device configured to rotate the chip picker to rotate the third semiconductor chip picked up by the chip picker.

A die bonding apparatus comprising:

• first and second bonding heads configured to respectively pickup first and second semiconductor chips at a first location;
• first and second transfer devices configured to respectively transfer the first and the second bonding heads to a second location along a transfer path, and the first and second transfer devices configured to return to the first point along respective first and second return paths;
• and
• a processor configured to alternatively apply first and second signals to the first transfer device and the processor configured to alternatively apply the second and the first signal to the second transfer device so the first and second bonding heads do not collide with each other.