Adhesive tape joining apparatus
AssigneeNitto Denko Corporation
InventorsNaoki Ishii, Masayuki Yamamoto
Life of this patent
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Abstract
A collection bobbin is provided on a vertical line that travels a center of a supply bobbin. A pair of connection mechanisms is provided at front both sides of a tape housing chamber. An adhesive tape transport carriage with connection portions at a forward end of a carriage frame is connected to the connection mechanisms in the apparatus body. Loading of a master roll of an adhesive tape to the supply bobbin and unloading of a roll of a residual cut tape may be performed at the same position.
Claims15
Adhesive tape joining apparatus that joins an adhesive tape to a semiconductor wafer, comprising:
- a holding table that holds the semiconductor wafer;
- a tape supply mechanism that supplies the strip adhesive tape wound about an original roll to the semiconductor wafer;
- a tape joining mechanism that joins the adhesive tape to the semiconductor wafer;
- a tape cutting mechanism that cuts the adhesive tape along a contour of the semiconductor wafer;
- a tape collecting section having a winding shaft traveling a center of the master roll set in the tape supply mechanism in a vertical line that winds up and collects a residual cut tape into a roll shape;
- and
- a connection mechanism that guides to a tape set position an adhesive tape transport carriage that loads the original roll to the tape supply mechanism and unloads the roll of the residual cut tape from the tape collecting section, and positions the adhesive tape transport carriage for connection thereof.
Adhesive tape joining apparatus that joins an adhesive tape to a semiconductor wafer, comprising:
- a holding table that holds the semiconductor wafer;
- a tape supply mechanism supplies from a master roll to the semiconductor wafer a strip carrier tape with a precut adhesive tape cut in advance in the semiconductor shape being joined and held with a given pitch;
- a tape joining mechanism that joins the adhesive tape to the semiconductor wafer while separating the adhesive tape by folding back the carrier tape with an edge member;
- a tape collecting section having a winding shaft traveling a center of the master roll set in the tape supply mechanism in a vertical line that winds up and collects the carrier tape separated with a separation member into a roll shape;
- and
- a connection mechanism that guides to a tape set position an adhesive tape transport carriage that loads the original roll to the tape supply mechanism and unloads the roll of the carrier tape from the tape collecting section, and positions the adhesive tape transport carriage for connection thereof.
Adhesive tape joining apparatus that joins a supporting adhesive tape to a ring frame and a semiconductor wafer for integration therewith, comprising:
- a work piece holding mechanism that holds each of the ring frame and the semiconductor wafer in a given attitude;
- a tape supply mechanism that supplies a carrier tape with a precut adhesive tape cut in advance in the ring frame being joined and held or a strip adhesive tape to a rear face of the ring frame that is held on the work piece holding mechanism;
- a tape joining unit that joins the adhesive tape to the ring frame and the semiconductor wafer held on the work piece holding mechanism by a joining roller that rolls while pressing the precut adhesive tape that is folded back with the separation member and fed out from the carrier tape or the strip adhesive tape;
- a tape cutting mechanism that cuts the strip adhesive tape along a contour of the ring frame;
- a tape collecting section having a winding shaft traveling a center of the master roll set in the tape supply mechanism in a vertical line that winds up and collects the residual tape subject to a cutting process or the carrier tape and
- a connection mechanism that guides to a tape set position an adhesive tape transport carriage that loads the original roll to the tape supply mechanism and unloads the roll of the residual tape or the carrier tape from the tape collecting section, and positions the adhesive tape transport carriage for connection thereof.
Dependencies are inferred from the claim text.