Method of filing adhesive and method of manufacturing head suspension
AssigneeNHK Spring Co., Ltd.
InventorEijiro FURUTA
Life of this patent
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Abstract
A method of filling an adhesive into a gap includes steps of introducing one or more capsules containing the adhesive having an adhering function and a setting function into the gap, discharging the adhesive from the adhesive capsules by applying energy to the adhesive capsules in the gap, and setting the adhesive in the gap by applying energy to the discharged adhesive. The method can easily fill the adhesive 1 into the gap 7 without achieving a pressure-bonding process.
Claims10
A method of filling an adhesive into a gap, comprising steps of:
- introducing one or more capsules containing the adhesive having an adhering function and a setting function into the gap;
- discharging the adhesive from the adhesive capsules by applying energy to the adhesive capsules in the gap;
- and
- setting the adhesive in the gap by applying energy to the discharged adhesive.
A method of filling an adhesive into a gap, comprising:
- introducing one or more lumps of the adhesive into the gap, the lumps each having an adhering function and a setting function that are sealed at ordinary temperature and pressure, and therefore, being easy to handle at the ordinary temperature and pressure;
- and
- releasing the adhering function and setting function of the adhesive and setting the adhesive in the gap by applying energy to the lumps in the gap.
A method of manufacturing a head suspension, the head suspension having a piezoelectric element, a base having an opening in which the piezoelectric element is arranged, and a load beam attached to the base, the piezoelectric element deforming in response to electric power applied thereto, to move a front end of the load beam in a sway direction, the method comprising steps of:
- introducing one or more microcapsules each containing a nonconductive adhesive having one of a thermosetting characteristic and an ultraviolet curing characteristic into a gap between an inner side face of the opening and an outer side face of the piezoelectric element, thereby filling the gap with the microcapsules;
- discharging the nonconductive adhesive from the microcapsules by applying one of thermal energy and light irradiation energy to the microcapsules in the gap;
- and
- setting the nonconductive adhesive in the gap by applying one of thermal energy and ultraviolet irradiation energy to the discharged nonconductive adhesive, thereby fixing the piezoelectric element to the opening with the nonconductive adhesive.
Dependencies are inferred from the claim text.