Method of manufacturing printed circuit board

A method of manufacturing a printed circuit board comprising:

• preparing a pair of raw materials, each formed by sequentially stacking a release film, a first insulating layer, and a first conductive layer, and an adhesive layer, respectively;
• embedding the pair of raw materials, which are opposed to each other, in the adhesive layer while disposing the release films toward an inner layer;
• forming a first circuit pattern by removing a portion of the first conductive layer;
• forming a second insulating layer, which has a via formed therethrough to be connected to the first circuit pattern and a second circuit pattern formed on an upper surface to be connected to the via, on the first insulating layer including the first circuit pattern;
• cutting edge portions of the second and first insulating layers, the release film, and the adhesive layer;
• and
• removing the release film from the first insulating layer.