High speed pull test device and method
AssigneeDage Precision Industries, Ltd.
InventorsBenjamin Kingsley Stuart Peecock, Robert John Sykes, Alan Norman Wiltshire
Life of this patent
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Abstract
A device and method for tensile testing of the bond strength of an electrically conductive ball adhered to a substrate. A ball is gripped and moved at a speed in a direction substantially orthogonal to the plane of adherence. The substrate is abruptly halted by an abutment to impose a sudden load on the ball/substrate interface. During the test the substrate is lightly urged toward the ball to eliminate unwanted tensile forces
Claims14
A method of testing the bond strength of an electrical connection adhered to a substrate, the substrate having a top surface, the method comprising the steps of:
- attaching a test tool to the electrical connection,
- moving the electrical connection in a direction substantially orthogonal to the top surface of the substrate while urging the substrate against the electrical connection,
- abruptly halting the substrate, and
- measuring the force required to break the electrical connection off of the substrate.
A method of testing the strength of the bond between an electrical connection and an electronic substrate at an electrical connection-substrate interface, the method comprising the steps of:
- securing the substrate to a platen;
- positioning the substrate a sufficient distance from a stationary abutment to permit the substrate to be moved towards the abutment;
- moving a test tool into engagement with the electrical connection so that the test tool can be attached to the electrical connection;
- moving the substrate and test tool in unison towards the abutment while urging the electrical connection against the test tool and while preventing rotation of the substrate relative to the test tool;
- causing the substrate to contact the abutment to abruptly halt the substrate;
- continuing to move the test tool while still being attached to the electrical connection to break the electrical connection off the substrate;
- and
- measuring the force required to break the electrical connection off the substrate.
Apparatus for testing the strength of the bond between an electrical connection and a substrate at an electrical connection-substrate interface, the substrate having a top surface, the apparatus comprising:
- a test tool adapted to be attached to an electrical connection adhered to a substrate;
- an apparatus for moving said test tool on an axis substantially orthogonal to the top surface of the substrate;
- an urging apparatus for urging the substrate on said axis towards said test tool, said urging apparatus adapted to move the substrate and electrical connection along said axis;
- an abutment adapted to restrain the substrate while the apparatus for moving said test tool continues to move said test tool along said axis to break the electrical connection off the substrate;
- and
- a force measuring apparatus configured to measure the force required to break the electrical connection off the substrate.
Dependencies are inferred from the claim text.