Hybrid thermoelectric-ejector cooling system

An active cooling system for transferring heat from a heat source to an external heat sink comprising:

• a. a low temperature evaporator adapted to receive a secondary fluid for evaporation of the secondary fluid to absorb heat from the heat source;
• b. a thermoelectric cooling module which uses electrical input power to generate heat flux;
• c. an ejector cooling module integrated with the thermoelectric module, the ejector cooling module including a high temperature evaporator adapted to container a primary fluid, the thermoelectric cooling module being disposed for rejecting heat into the high temperature evaporator of the ejector cooling module, a converging-diverging nozzle connected to the high temperature evaporator for accelerating primary fluid to a high velocity and producing low static pressure, a mixing chamber for receiving high velocity primary fluid from the converging-diverging nozzle and aspirating secondary fluid vapor from the low temperature evaporator, a diffuser chamber for receiving mixed primary and secondary fluid vapor from the mixing chamber, the diffuser chamber being adapted to transition the flow of mixed primary and secondary fluids from high speed to stagnation so that the mixed flow can gain static pressure;
• d. a condenser adapted to receive the primary and secondary fluid vapor from the ejector's diffuser chamber and reject heat to a heat sink outside the cooling system so that the vaporous primary and secondary fluids lower their temperature to their saturation points and liquefy;
• e. a wick structure connecting the condenser to the high temperature evaporator so that the liquids in the condenser can travel from the condenser to the high temperature evaporator by way of capillary force;
• f. a micro/nano-structured surface within the high temperature evaporator to distribute the liquid within the high temperature evaporator and to enhance thin film evaporation heat transfer;
• g. a duct between the high temperature evaporator and the low temperature evaporator constructed to pass fluid from the high temperature to the low temperature evaporator at a certain flow rate of liquid to provide sufficient flow to the low temperature evaporator but not so much flow that the high temperature evaporator lacks sufficient fluid for heat transfer from the thermoelectric cooling module or for powering the ejector;
• h. a micro/nano-structured surface within the low temperature evaporator to distribute the liquid within the low temperature evaporator and to enhance thin film evaporation heat transfer;
• i. insulating material located between at least one of,
• i. the condenser and high temperature evaporator;
• and
• ii. the ejector's diffuser and high temperature evaporator