Back to results
US 2011/0076905 A1Published application
Pressure-sensitive adhesive composed of polypropylene resin
AssigneeTesa SE
InventorsBernhard Müssig, Dennis Seitzer
Life of this patent
Estimating the term…
Abstract
Pressure sensitive adhesive comprised of a polypropylene resin of low density and high melting point and at least one tackifying resin
Claims19
A pressure-sensitive adhesive comprising a polypropylene resin having a density of between 0.86 and 0.89 g/cm3, a crystallite melting point of at least 105° C., and comprising at least one tackifier resin, the fraction of the tackifier resin being at least 20 phr.
canceled
Dependencies are inferred from the claim text.