US 2011/0048626 A1Published application

Application of a processing pin to a gemstone which is to be cut or polished

AssigneePaul Wild OHG

InventorsMarkus Paul Wild, Stefan Koehler

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Abstract

A next processing pin is applied as a follow-on pin to a stone, wherein the stone is held by a preceding pin and fixed to the stone by way of a first adhesive bonding location. The preceding pin is separated from the stone. The follow-on pin is fixed to the stone by way of a second adhesive bonding location spaced from the first adhesive bonding location. The follow-on pin frontally receives a fluid adhesive at a spacing from the stone and the spacing between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone. The adhesive is hardened at the contact location as the second adhesive bonding location and heat is transferred by way of the preceding pin to the first adhesive bonding location A force component is exerted on the preceding pin to release the pin from the stone and to hold the stone with the next pin.

Claims49

Dependent claims

A method of applying a next handling or processing pin as a follow-on to a stone, in particular a jewel, wherein the stone is held by a preceding pin being fixed to the stone by way of a first adhesive bonding location, wherein the preceding pin (10) is to be separated off from the stone to hold it with the next pin as the follow-on pin (20, 30), the follow-on pin is fixed to the stone by way of a second adhesive bonding location (21, 31) spaced from the first adhesive bonding location;

wherein
the stone is held by the preceding pin at least during the application of the follow-on pin;
the follow-on pin frontally receives a fluid adhesive in a distance from the stone and a space between the adhesive-coated front end and the stone is reduced until the adhesive front end contacts the stone;
the adhesive is hardened at the contact location as the second adhesive bonding location;
heat is transmitted to the first adhesive bonding location through the preceding pin, which heat is introduced into the preceding pin at a spacing from the first adhesive bonding location to soften or weaken the first adhesive bonding location;
and
a mechanical force component is applied to the preceding pin for releasing and separating that pin from the stone and holding the stone with the next pin as the follow-on pin.

4 more elements

Dependencies are inferred from the claim text.

Facts

Application: 12/810,079Filed 23 Dec 2008
Priority: DE 102007062638.123 Dec 2007
Published: 3 Mar 2011
Term ends: Not estimatedThe source records don’t support an estimate.

Classification8 codes

B24B 9/16
Of non-metallic inorganic material, e.g. stone, ceramics, porcelain: of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs
B24B 9/161
Of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs: dops, dop holders
B24B 9/167
Of diamonds; of jewels or the like; Diamond grinders' dops; Dop holders or tongs: with means for turning and positioning the gem stones
Y10T 29/49817
Disassembling: with other than ancillary treating or assembling