Method and apparatus for wireless transmission of diagnostic information
AssigneeTaiwan Semiconductor Manufacturing Company, Ltd.
InventorsHsu-Shui Liu, Jiun-Rong Pai, Yeh-Chieh Wang
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Abstract
The present disclosure provides a system for fabricating a semiconductor device. The system includes a semiconductor fabrication tool. The semiconductor fabrication tool has an integrated inter interface that measures a first process parameter of the fabrication tool. The system also includes a wireless sensor. The wireless sensor is detachably coupled to the fabrication tool. The wireless sensor measures a second process parameter of the fabrication tool. The second process parameter is different from the first process parameter.
Claims20
A system for fabricating a semiconductor device, comprising:
- a semiconductor fabrication tool having an integrated interface that measures a first process parameter of the fabrication tool;
- and
- a wireless sensor detachably coupled to the fabrication tool, wherein the sensor measures a second process parameter of the fabrication tool, the second process parameter being different from the first process parameter.
A system for fabricating a semiconductor device, comprising:
- a semiconductor fabrication tool having a sensor that gathers fabrication data from the fabrication tool;
- a first wireless transceiver that is coupled to the sensor, the first wireless transceiver transmitting wireless signals that include the fabrication data;
- a second wireless transceiver that wirelessly communicates with the first wireless transceiver and that receives fabrication data from the first transceiver;
- and
- a diagnostic device that is coupled to the second transceiver and that receives the fabrication data and performs analysis in response to the fabrication data.
A method of fabricating a semiconductor device, comprising:
- measuring a first semiconductor fabrication process parameter of a semiconductor fabrication tool using an integrated interface of the fabrication tool;
- and
- measuring a second semiconductor fabrication process parameter of the fabrication tool using a wireless sensor that is detachably coupled to the fabrication tool, the second semiconductor fabrication process parameter being different from the first semiconductor fabrication process parameter.
Dependencies are inferred from the claim text.