Semi-Aqueous Stripping and Cleaning Formulation for Metal Substrate and Methods for Using Same
AssigneeAir Products and Chemicals, Inc.
InventorMatthew I. Egbe
Life of this patent
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Abstract
The present invention relates to semi-aqueous formulations and the method using same, to remove bulk photoresists, post-etched and post-ashed residues, as well as contaminations. The formulation comprises: an alkanolamine, a water miscible organic co-solvent, a quarternary ammonium compound, a non-free acid functionality corrosion inhibitor, and remainder water. The pH is greater than 9.
Claims20
A semi-aqueous stripping and cleaning formulation, comprising:
- a. alkanolamine;
- b. water miscible organic co-solvent;
- c. quarternary ammonium compound;
- d. non-free acid functionality corrosion inhibitor;
- and,
- e. water;
- wherein pH of the formulation is greater than 9.
A semi-aqueous stripping and cleaning formulation, comprising:
- a. an alkanolamine selected from the group consisting of monoethanolamine, N-methylethanolamine, and mixtures thereof;
- b. a water miscible organic co-solvent selected from propylene glycol (PG), dipropylene glycol methyl ether(DPM), tripropylene glycol methyl ether(t-PGME), tetrahydrofurfuryl alcohol (THFA), and mixtures thereof;
- c. from 0.5% to 10% by weight of a quarternary ammonium compound selected from the group consisting of tetramethylammonium hydroxide (TMAH), tetraethylammonium hydroxide, tetrabutylammonium hydroxide (TBAH), and mixtures thereof;
- d. from 0.5% to 15% by weight of a corrosion inhibitor selected from, t-Butylcatechol, pyrogallol, and mixtures thereof;
- e. remainder water;
- wherein a total percent weight of the alkanolamine and the water miscible organic co-solvent is from 5% to 40% by weight, and the pH of the formulation is greater than 9.
A method of removing photoresist, etch or ash residue, and contaminants from a semiconductor substrate, comprising:
- contacting the semiconductor substrate with a formulation, comprising:
- a. alkanolamine;
- b. water miscible organic co-solvent;
- c. quarternary ammonium compound;
- d. non-free acid functionality corrosion inhibitor;
- and
- e. water;
- wherein the pH of the formulation is greater than 9.
A semi-aqueous stripping and cleaning formulation, comprising:
- a. 10% by weight N-methylethanolamine;
- b. 10% by weight dipropylene glycol methyl ether(DPM);
- c. 0.6% by weight tetramethylammonium hydroxide (TMAH);
- d. 10% by weight pyrogallol;
- and
- e. remainder water;
- wherein pH of the formulation is greater than 9.
A semi-aqueous stripping and cleaning formulation, comprising:
- a. 19-22% by weight monoethanolamine;
- b. 12% by weight dipropylene glycol methyl ether(DPM);
- c. 2.3-3.5% by weight tetramethylammonium hydroxide (TMAH);
- d. 2.3% by weight t-Butylcatechol;
- and
- e. remainder water;
- wherein pH of the formulation is greater than 9.
Dependencies are inferred from the claim text.