Back to results
US 2011/0034107 A1Published application
Method and apparatus for reciprocal polishing
OwnerZine-Eddine Boutaghouinventor
Life of this patent
Estimating the term…
Abstract
A polishing pad is located on a reciprocal motion generator. The polishing pad includes a plurality of discrete fluid channels. An abrasive article is located on the polishing pad. The abrasive article is reciprocally energized relative to the work piece. A fluid pressure in one or more of the discrete fluid channels is altered to selectively deform the abrasive article to preferentially remove material from the work piece.
Claims19
A polishing apparatus for polishing work pieces, the polishing apparatus comprising:
- a reciprocal motion generator;
- a polishing pad located on the reciprocal motion generator, the polishing pad having a plurality of discrete fluid channels;
- an abrasive article located on the polishing pad;
- and
- a controller fluidly coupled to the discrete fluid channels and programmed to selectively alter a fluid pressure in one or more of the discrete fluid channels to selectively deform the abrasive article to preferentially remove material from the work piece.
2 more elements
A method of polishing a work piece comprising the steps of:
- locating a polishing pad on a reciprocal motion generator, the polishing pad including a plurality of discrete fluid channels;
- locating an abrasive article on the polishing pad;
- reciprocally energizing the abrasive article relative to the work piece;
- and
- selectively altering a fluid pressure in one or more of the discrete fluid channels to selectively deform the abrasive article to preferentially remove material from the work piece.
2 more elements
Dependencies are inferred from the claim text.