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US 2011/0034002 A1Published application
Systems and methods to laminate passives onto substrate
AssigneeIntel Corporation
InventorsHuankiat Seh, Yongki Min, Islam A. Salama
Life of this patent
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Abstract
A method may include depositing a dielectric layer onto a substrate, removing portions of the dielectric layer to create a plurality of separated non-removed portions of the dielectric layer, depositing one or more passive electronic components into each of the plurality of separated non-removed portions, and curing the separated non-removed portions of the dielectric layer.
Claims6
1-10. (canceled)
A method comprising:
- depositing a dielectric layer onto a substrate;
- modifying the dielectric layer to create a plurality of mounting portions separated by a plurality of non-mounting portions, the non-mounting portions extending higher above the substrate than the mounting portions;
- depositing one or more passive electronic components onto each of the plurality of mounting portions;
- and
- curing the plurality of mounting portions and the plurality of non-mounting portions of the dielectric layer.
2 more elements
Dependencies are inferred from the claim text.