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US 2011/0034001 A1Published application
Method of making bipolar transistor
AssigneeNXP B.V.
InventorsSebastien Nuttinck, Erwin Hijzen, Johannes J. T. M. Donkers, Guillaume L. R. Boccardi
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Abstract
A method of manufacturing a bipolar transistor is compatible with FinFET processing. A collector region (18) is formed and patterned, base contact regions (26) formed on either side, and a gap formed between the base contact region. A base (28), spacers (30) and an emitter (32) are formed in the gap.
Claims12
A method of manufacturing a bipolar transistor, comprising
- defining a collector region of semiconductor having a central region longitudinally between end regions;
- forming an insulating layer on the lateral sidewalls and top of the collector region in the central region;
- forming base contact regions on both lateral sides of the collector region in the central region;
- forming a gap between the tops of the base contact regions, the gap exposing the collector region in the central region;
- depositing a base semiconductor layer (2) on the exposed collector region in the gap, on the sidewalls of the gap and the tops of the polysilicon base contact region adjacent to the gap;
- forming spacers on the lateral inside edges of the base semiconductor layer in the gap;
- and
- filling the gap with an emitter semiconductor layer.
5 more elements
Dependencies are inferred from the claim text.