Method of manufacturing a semiconductor device having a semiconductor chip and resin sealing portion
AssigneeMitsubishi Electric Corporation
InventorTAKETOSHI SHIKANO
Life of this patent
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Abstract
A method of manufacturing a semiconductor device includes preparing a semiconductor chip having a main surface, forming a conductive portion made from a material having conductivity and malleability on the main surface, arranging the semiconductor chip within a die after the step of forming the conductive portion, the die having an inner surface facing the main surface with a spacing therebetween, and a protruding portion protruding from the inner surface to press the conductive portion, and forming a sealing resin portion having a surface and an opening by filling the die with a resin and then removing the die, the surface facing the main surface, the opening passing through between the conductive portion and the surface.
Claims2
A method of manufacturing a semiconductor device, comprising:
- preparing a semiconductor chip having a main surface;
- forming a conductive portion made from a material having conductivity and malleability on said main surface;
- arranging said semiconductor chip within a die after the step of forming said conductive portion, said die having an inner surface facing said main surface with a spacing therebetween, and a protruding portion protruding from said inner surface to press said conductive portion;
- and
- forming a sealing resin portion having a surface and an opening by filling said die with a resin and then removing said die, said surface facing said main surface, said opening passing through between said conductive portion and said surface.
Dependencies are inferred from the claim text.