Manufacturing Method for Integrating a Shunt Resistor into a Semiconductor Package
AssigneeTexas Instruments Incorporated
InventorsUbol Udompanyavit, Sreenivasan K. Koduri, Gerald W. Steele, Jason Marc Cole, Steven Kummerl
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Abstract
An integrated circuit package that comprises a lead frame, an integrated circuit located on the lead frame and a shunt resistor coupled to the lead frame and to the integrated circuit. The shunt resistor has a lower temperature coefficient of resistance than the lead frame, and the lead frame has a lower resistivity than the shunt resistor. The shunt resistor has a low-resistance coupling to external leads of the lead frame, or, the shunt resistor has its own integrated external leads.
Claims16
A method of manufacturing an integrated circuit package, comprising:
- coupling a shunt resistor to a lead frame with external leads, wherein said shunt resistor has a lower temperature coefficient of resistance than said lead frame, and said lead frame has a lower resistivity than said shunt resistor, attaching an integrated circuit to a surface of said lead frame;
- electrically connecting said integrated circuit to said shunt resistor and to said lead frame;
- and
- encompassing said shunt resistor and said integrated circuit with a molding material.
Dependencies are inferred from the claim text.