Mold cleaning sheet and method of producing semiconductor devices using the same

A method of manufacturing a semiconductor device comprising the steps of:

• (a) providing a mold having a first mold, a first cavity formed on the first mold, a gate connected to the first cavity, a flow cavity connected to the first cavity, and a second mold opposed to the first mold;
• (b) disposing a lead frame with a semiconductor chip between the first and second molds such that the semiconductor chip is arranged inside of the first cavity, supplying an encapsulating resin into the first cavity through the gate, and sealing the semiconductor chip with the encapsulating resin;
• and
• (c) disposing a cleaning sheet between the first and second molds, supplying a cleaning resin into the first cavity through the gate, and cleaning the mold,
• wherein the first cavity in a plan view is a quadrangle,
• wherein the gate is connected to a first corner portion,
• wherein the flow cavity is connected to a second corner portion opposing to the first corner portion via a central portion of the first cavity in the plan view,
• wherein the cleaning resin has a filler,
• wherein in the step (b), the encapsulating resin is supplied into the flow cavity through the first cavity,
• wherein in the step (c), the cleaning sheet is disposed between the first and second molds such that the cut portion is overlapped with the flow cavity in the plan view, and
• wherein in the step (c), the cleaning resin is supplied into the flow cavity through the first cavity and the cut portion.