Stacked semiconductor package electrically connecting semiconductor chips using outer surfaces thereof and method for manufacturing the same
AssigneeHynix Semiconductor Inc.
InventorTac Keun OH
Life of this patent
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Abstract
A stacked semiconductor package and a method for manufacturing the same. The stacked semiconductor package includes a semiconductor chip module having two or more semiconductor chips which are stacked in the shape of steps. Each of the semiconductor chips includes pads located on an upper surface thereof and an inclined side surface connected with the upper surface. Connection patterns are formed in the shape of lines on the inclined side surfaces and the upper surfaces of the semiconductor chips to electrically connect pads of the semiconductor chips.
Claims21
A method for manufacturing a stacked semiconductor package, comprising the steps of:
- individualizing two or more semiconductor chips from a wafer so as to define a first inclined side surface and a second inclined side surface opposite the first inclined side surface on each semiconductor chip, wherein each semiconductor chip has pads located on an upper surface thereof, and an angle defined between the first inclined side surface and the upper surface is an obtuse angle, and an angle defined by the second inclined side surface and the upper surface is an acute angle;
- forming a semiconductor chip module by stacking the two or more semiconductor chips in the shape of steps such that the pads are exposed;
- and
- forming connection patterns in the type of lines on at least one of the first and second inclined side surfaces and the upper surface of each semiconductor chip to electrically connect pads located on the respective semiconductor chips.
(canceled)
A method for manufacturing a stacked semiconductor package, comprising the steps of:
- individualizing two or more semiconductor chips from a wafer so as to define a first inclined side surface and a second inclined side surface opposite the first inclined side surface on each semiconductor chip, wherein each semiconductor chip has pads located on an upper surface thereof, and an angle defined between the first inclined side surface and the upper surface is an obtuse angle, and an angle defined between the second inclined side surface and the upper surface is an obtuse angle:
- forming a semiconductor chip module by stacking the two or more semiconductor chips in the shape of steps such that the pads are exposed;
- forming connection patterns in the type of lines on at least one of the first and second inclined side surfaces and the upper surface of each semiconductor chip to electrically connect pads located on the respective semiconductor chips.
Dependencies are inferred from the claim text.