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US 2011/0033976 A1Published application
Self-assembly of chips on a substrate
AssigneeCommiss. A L'energie Atom. Et Aux Energ. Alterna.
InventorsLea Di Cioccio, Francois Grossi, Pierric Gueguen, Laurent Vandroux
Life of this patent
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Abstract
A method of forming, on a surface of a substrate, at least one hydrophilic attachment area for the purpose of self-assembling a component or a chip, in which a hydrophobic area, which delimits the hydrophilic attachment area, is produced.
Claims21
1-20. (canceled)
A method of assembling one or more components or chips and a substrate, comprising:
- a) formation, on a surface of the substrate, of at least one hydrophilic attachment area for purpose of self-assembling the component(s) or the chip(s), and a hydrophobic area, which delimits the hydrophilic attachment area(s);
- and
- b) alignment and assembly of the component(s) or the chip(s) on the attachment area(s), by a drop of a hydrophilic liquid, the assembly being carried out by molecular bonding or thermocompression.
Dependencies are inferred from the claim text.