Loading patent…
AssigneeHitachi Kokusai Electric Inc.
InventorMasanori SAKAI
Estimating the term…
A substrate processing apparatus, a method of manufacturing a semiconductor device, and a method of confirming an operation of a liquid flowrate control device are provided. The substrate processing apparatus comprises: a process chamber accommodating a substrate; a liquid source supply system supplying a liquid source into the process chamber; a solvent supply system supplying a solvent having a vapor pressure greater than that of the liquid source into the process chamber; a liquid flowrate control device controlling flowrates of the liquid source and the solvent; and a controller controlling the liquid source supply system, the solvent supply system, and the liquid flowrate control device so that the solvent is supplied into the liquid flowrate control device than the solvent supply system to confirm an operation of the liquid flowrate control device before the liquid source supply system supplies the liquid source into the process chamber.
A substrate processing apparatus comprising:
A method of method of manufacturing a semiconductor device, the method comprising:
A method of confirming an operation of a liquid flowrate control device, the method comprising:
Dependencies are inferred from the claim text.