Electrochemical device
AssigneeTaiyo Yuden Co., Ltd.
InventorsKatsuei Ishida, Kazushi Yawata, Naoto Hagiwara, Motoki Kobayashi
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Abstract
An electrochemical device capable of being mounted by soldering includes a film package made of a film; an electrodes part encapsulated together with an electrolyte in said film package; a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package; and an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.
Claims10
An electrochemical device capable of being mounted by soldering, comprising:
- a film package made of a film;
- an electrodes part encapsulated together with an electrolyte in said film package;
- a pair of terminals, one end of each terminal being connected to said electrodes part and another end of each terminal being exposed to an exterior of said film package;
- and
- an armor in contact with a substantially entire surface of said film package and in contact with partial surfaces of the exposed ends of said pair of terminals, respectively, to encapsulate said film package, said armor exposing remaining portions of said pair of terminals to an exterior of the armor.
Dependencies are inferred from the claim text.