Self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, and method of use

Abstract

The present disclosure relates to a self-aligned metal mask assembly for selectively depositing thin films on microelectronic substrates and devices, comprising the following parts: a) an upper metal mask with the orifices or zones that define the patterns to be metalized, said mask having centring holes, b) a lower metal mask with orifices of the same size and shape as the substrates or devices to be metalized, and further auxiliary holes for centring the assembly, c) a piece or base provided with rods corresponding to the auxiliary holes, for centring the above parts, an upper piece or frame for securing and keeping the complete assembly aligned by means of screws and slight pressure. The assembly can in turn be secured to the sample-holder of the deposition machine.

Dependencies are inferred from the claim text.