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US 2011/0033717 A1Published application
Method for bonding ceramic materials
AssigneeCaldera Engineering, LC
InventorsJohn Roger Peterson, M. Robert Mock
Life of this patent
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Abstract
Systems and methods for bonding ceramic materials are disclosed herein. In various embodiments, a process is provided comprising the steps of disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component, and bonding said first silicon carbide component to said second silicon carbide component by heating, wherein said bonding material comprises vanadium or titanium.
Claims21
A method comprising:
- disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component;
- bonding said first silicon carbide component to said second silicon carbide component by heating;
- and
- wherein said bonding material comprises vanadium.
1 more element
An article of manufacture produced by a process comprising:
- disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component;
- bonding said first silicon carbide component to said second silicon carbide component by heating;
- and
- wherein said bonding material comprises vanadium.
1 more element
A method comprising:
- disposing a bonding material at least partially adjacent to a surface of a first silicon carbide component and at least partially adjacent to a surface of a second silicon carbide component;
- and
- bonding said first silicon carbide component to said second silicon carbide component by heating,
- wherein said bonding material comprises titanium.
1 more element
Dependencies are inferred from the claim text.